Catalog

The Dual SMP System brings Bostik's SMP Technology to the next level by providing speed and security. This is done by adding a small amount of a waterbased B-Component that catalyzes the adhesive bead to cure throughout at the same rate. Cure progression of the one-component products, by contrast, is from the "outside-in"

The handheld Dual SMP 400P Gun is designed to deliver the adhesive and the B-Component at the proper ratio. It uses a unique static mixer to meter and mix the adhesive and B-more
Unit of Measure

Specifications

Type

Dual SMP 400P Applicator Gun

Capacity

400 mL

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